SMDLTLFP500T3 Details _SMDLTLFP500T3 Related parameters PDF

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In Stock：19,632(Ref. price)

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1	$126.67050	$126.67050

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Specifications

Description	Details
Series	-
Package	Jar
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	281°F (138°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 17.64 oz (500g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)

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Price advantage, SMDLTLFP500T3 is available in stock and can be delivered on the same day

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