WS991LT500T4 Details _WS991LT500T4 Related parameters PDF

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Specifications

Description	Details
Series	CHIPQUIK®
Package	Bulk
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	361°F (183°C)
Flux Type	Water Soluble
Wire Gauge	-
Process	Leaded
Form	Jar, 17.64 oz (500g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-

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