1354291 Details _1354291 Related parameters PDF

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Specifications

Description	Details
Series	WS300
Package	Bulk
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423°F (217°C)
Flux Type	Water Soluble
Wire Gauge	-
Process	Lead Free
Form	Jar, 17.64 oz (500g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	35.6°F ~ 46.4°F (2°C ~ 8°C)

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