70-3205-1812 Details _70-3205-1812 Related parameters PDF

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Specifications

Description	Details
Series	NXG1
Package	Bulk
Type	Solder Paste
Composition	Sn99Cu0.7Ag0.3 (99/0.7/0.3)
Diameter	-
Melting Point	-
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Cartridge, 35.27 oz (1kg)
Shelf Life	8 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	32°F ~ 50°F (0°C ~ 10°C)

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