733001 Details _733001 Related parameters PDF

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Specifications

Description	Details
Series	C511™
Package	Spool
Type	Wire Solder
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	0.022" (0.56mm)
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	23 AWG, 24 SWG
Process	Lead Free
Form	Spool, 8.8 oz (250g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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