96-7069-9520 Details _96-7069-9520 Related parameters PDF

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Specifications

Description	Details
Series	268
Package	Bulk
Type	Wire Solder
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	0.020" (0.51mm)
Melting Point	423 ~ 424°F (217 ~ 218°C)
Flux Type	No-Clean
Wire Gauge	24 AWG, 25 SWG
Process	Lead Free
Form	Spool, 17.64 oz (500g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	50°F ~ 104°F (10°C ~ 40°C)

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