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DE02014

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Specifications
DescriptionDetails
Series
-
Package
Bag
Proto Board Type
SMD to DIP
Package Accepted
SOIC, SOP, SSOP
Number of Positions
14
Pitch
0.100"" (2.54mm)
Board Thickness
0.063"" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.740"" L x 0.744"" W (18.80mm x 18.90mm)
Other
Price advantage, DE02014 is available in stock and can be delivered on the same day
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