833900T00000 Details _833900T00000 Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Board Level
Package Cooled	TO-263 (D²Pak)
Attachment Method	SMD Pad
Shape	Rectangular, Fins
Length	0.590" (15.00mm)
Width	1.020" (25.91mm)
Diameter	-
Fin Height	0.375" (9.52mm)
Power Dissipation @ Temperature Rise	2.0W @ 40°C
Thermal Resistance @ Forced Air Flow	5.00°C/W @ 400 LFM
Thermal Resistance @ Natural	-
Material	Copper
Material Finish	Tin

Other

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