APR55-55-23CB/A01 Details _APR55-55-23CB/A01 Related parameters PDF

Thermal - Heat Sinks

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In Stock：19,382(Ref. price)

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Specifications

Description	Details
Series	APR
Package	Tray
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Pin Fins
Length	2.150" (54.60mm)
Width	2.150" (54.60mm)
Diameter	-
Fin Height	0.890" (22.61mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	1.84°C/W @ 200 LFM
Thermal Resistance @ Natural	6.24°C/W
Material	Aluminum Alloy
Material Finish	Black Anodized

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Price advantage, APR55-55-23CB/A01 is available in stock and can be delivered on the same day

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