APF19-19-10CB Details _APF19-19-10CB Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	APF
Package	Box
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Fins
Length	0.748" (19.00mm)
Width	0.748" (19.00mm)
Diameter	-
Fin Height	0.370" (9.40mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	5.30°C/W @ 200 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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