1963842-2 Details _1963842-2 Related parameters PDF_TE Connectivity AMP Connectors-IC-STK

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Bag
Type	Board Level
Package Cooled	QSFP
Attachment Method	Adhesive
Shape	Rectangular, Pin Fins
Length	1.801" (45.74mm)
Width	0.738" (18.75mm)
Diameter	-
Fin Height	0.256" (6.50mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	-
Material	-
Material Finish	-

Other

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