2283B Details _2283B Related parameters PDF_Aavid, Thermal Division of Boyd Corporation-IC-STK

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Board Level
Package Cooled	BGA
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Fins
Length	0.655" (16.64mm)
Width	0.655" (16.64mm)
Diameter	-
Fin Height	0.265" (6.73mm)
Power Dissipation @ Temperature Rise	1.0W @ 40°C
Thermal Resistance @ Forced Air Flow	17.50°C/W @ 300 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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