BDN09-3CB Details _BDN09-3CB Related parameters PDF_CTS Thermal Management Products-IC-STK

Thermal - Heat Sinks

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In Stock：5,438(Ref. price)

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Specifications

Description	Details
Series	BDN
Package	Box
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Pin Fins
Length	0.910" (23.11mm)
Width	0.910" (23.11mm)
Diameter	-
Fin Height	0.355" (9.02mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 400 LFM
Thermal Resistance @ Natural	26.90°C/W
Material	Aluminum
Material Finish	Black Anodized

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