6025DG Details _6025DG Related parameters PDF_Aavid, Thermal Division of Boyd Corporation-IC-STK

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Board Level, Vertical
Package Cooled	TO-220
Attachment Method	Bolt On and PC Pin
Shape	Rectangular, Fins
Length	1.250" (31.75mm)
Width	0.875" (22.23mm)
Diameter	-
Fin Height	0.250" (6.35mm)
Power Dissipation @ Temperature Rise	3.0W @ 60°C
Thermal Resistance @ Forced Air Flow	7.00°C/W @ 400 LFM
Thermal Resistance @ Natural	17.90°C/W
Material	Copper
Material Finish	Tin

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