303MM Details _303MM Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	303
Package	Bulk
Type	Board Level, Vertical
Package Cooled	Stud Mounted Semiconductor Cases
Attachment Method	Press Fit
Shape	Rectangular, Fins
Length	2.000" (50.80mm)
Width	3.000" (76.20mm)
Diameter	-
Fin Height	2.000" (50.80mm)
Power Dissipation @ Temperature Rise	15.0W @ 37°C
Thermal Resistance @ Forced Air Flow	1.30°C/W @ 250 LFM
Thermal Resistance @ Natural	-
Material	Aluminum Alloy
Material Finish	Black Anodized

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