6230DG (COPPER) Details _6230DG (COPPER) Related parameters PDF_Aavid, Thermal Division of Boyd Corporation-IC-STK

Thermal - Heat Sinks

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Board Level, Vertical
Package Cooled	TO-220
Attachment Method	Bolt On and PC Pin
Shape	Rectangular, Fins
Length	1.180" (29.97mm)
Width	1.000" (25.40mm)
Diameter	-
Fin Height	0.500" (12.70mm)
Power Dissipation @ Temperature Rise	1.0W @ 20°C
Thermal Resistance @ Forced Air Flow	6.00°C/W @ 300 LFM
Thermal Resistance @ Natural	12.50°C/W
Material	Copper
Material Finish	Tin

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