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FVP18030IM3LSG1 Picture

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FVP18030IM3LSG1

  • ON Semiconductor
  • New
  • MODULE SPM 300V VPM19-AA
  • Datasheet download
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Specifications
DescriptionDetails
Series
SPM®
Package
Tray
Type
IGBT
Configuration
Half Bridge
Current
180 A
Voltage
300 V
Voltage - Isolation
1500Vrms
Mounting Type
Through Hole
Package / Case
19-PowerDIP Module (1.205", 30.60mm)
Other
Price advantage, FVP18030IM3LSG1 is available in stock and can be delivered on the same day
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