8468-21B1-RK-TP Details _8468-21B1-RK-TP Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	8400
Package	Tube
Type	PLCC
Number of Positions or Pins (Grid)	68 (4 x 17)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	160.0µin (4.06µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	160.0µin (4.06µm)
Contact Material - Post	Copper Alloy
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-40°C ~ 105°C

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