MPP-1100-05-DS-4GR(S1402) Details _MPP-1100-05-DS-4GR(S1402) Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	Transistor, TO-220 and TO-247
Number of Positions or Pins (Grid)	5 (Rectangular)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Nickel Boron
Mounting Type	Through Hole, Right Angle
Features	-
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Nickel Boron
Housing Material	Polyphenylene Sulfide (PPS)
Operating Temperature	-65°C ~ 200°C

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