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Sockets for ICs Transistors
36-6553-18 Picture

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36-6553-18

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In Stock:19,836(Ref. price)
Qty.Unit PriceExt. Price
1
$95.95483
$95.95483
Documents
Specifications
DescriptionDetails
Series
55
Package
Bulk
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Other
Price advantage, 36-6553-18 is available in stock and can be delivered on the same day
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