818-AG11SM Details _818-AG11SM Related parameters PDF_TE Connectivity AMP Connectors-IC-STK

Sockets for ICs Transistors

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Specifications

Description	Details
Series	800
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	-
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	-
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic, Polyester
Operating Temperature	-

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