821949-4 Details _821949-4 Related parameters PDF_TE Connectivity AMP Connectors-IC-STK

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tube
Type	QFP
Number of Positions or Pins (Grid)	100 (4 x 25)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-

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