117-83-430-41-105101 Details _117-83-430-41-105101 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	117
Package	Bulk
Type	DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)	30 (2 x 15)
Pitch - Mating	0.070" (1.78mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

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