8080-1G35 Details _8080-1G35 Related parameters PDF_TE Connectivity AMP Connectors-IC-STK

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Transistor, TO-3
Number of Positions or Pins (Grid)	3 (Oval)
Pitch - Mating	-
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Chassis Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Beryllium Copper
Housing Material	Diallyl Phthalate (DAP)
Operating Temperature	-55°C ~ 125°C

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