518-77-360M19-001105 Details _518-77-360M19-001105 Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	518
Package	Bulk
Type	PGA
Number of Positions or Pins (Grid)	360 (19 x 19)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	Flash
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	Flash
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

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