655-53AB Details _655-53AB Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	655
Package	Bulk
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Square, Pin Fins
Length	1.600" (40.64mm)
Width	1.600" (40.64mm)
Diameter	-
Fin Height	0.522" (13.27mm)
Power Dissipation @ Temperature Rise	4.0W @ 40°C
Thermal Resistance @ Forced Air Flow	2.00°C/W @ 400 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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